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portada Electronic Packaging for High Reliability, Low Cost Electronics
Type
Physical Book
Publisher
Author
Year
2010
Language
English
Pages
296
Format
Paperback
ISBN
904815085x
ISBN13
9789048150854
Categories

Electronic Packaging for High Reliability, Low Cost Electronics

Tummala, R. R. ; Kosec, Marija ; Jones, W. K. (Author) · Springer · Paperback

Electronic Packaging for High Reliability, Low Cost Electronics - Tummala, R. R. ; Kosec, Marija ; Jones, W. K.

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Synopsis "Electronic Packaging for High Reliability, Low Cost Electronics"

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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