Name: Foldable Flex and Thinned Silicon Multichip Packaging Technology
SKU: 58149465
Price: 145.88 EUR
Availability: InStock
Author: Balde, John W.
ISBN: 9781461349778

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portada Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Type

Physical Book

Publisher

Springer

Author

Balde, John W.

Language

English

Pages

347

Format

Paperback

Dimensions

23.4x15.6x2 cm

Weight

0.52 kg.

ISBN13

9781461349778

Synopsis "Foldable Flex and Thinned Silicon Multichip Packaging Technology"

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

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Foldable Flex and Thinned Silicon Multichip Packaging Technology - Balde, John W.

Synopsis "Foldable Flex and Thinned Silicon Multichip Packaging Technology"

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