Hallo! Tracked shipping to Netherlands with Delivery Duty Paid for just €7 

Ship to
Netherlands
0
  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

Select your country

Americas

Europe

Rest of the world

portada Microelectronic Packaging: A Bibliography
Type
Physical Book
Publisher
Language
English
Pages
244
Format
Paperback
Dimensions
25.4 x 17.8 x 1.4 cm
Weight
0.45 kg.
ISBN13
9781468461077

Microelectronic Packaging: A Bibliography

A. H. Agajanian (Author) · Springer · Paperback

Microelectronic Packaging: A Bibliography - Agajanian, A. H.

Cheaper New Book Imported to Netherlands
Delivery: 04 Sep - 11 Sep Shipping: 12 to 16 business days.
€ 98,66
Faster New Book Imported to Netherlands
Delivery: 24 Aug - 26 Aug Shipping: 4 to 5 business days.
€ 134,46
Import costs and 9% BTW included in the price ✅
€ 98,66

Synopsis "Microelectronic Packaging: A Bibliography"

Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protection function avoids mechanical, electrical, chemical, contamination, and photo-optical damage, degeneration, and causes of malfunction. Hybrid microelectronic circuits and subsystem packages support the substrates; the substrate contains the circuit elements, (semiconductor devices or IC chips, deposited or chip resistors and capacitors, and attached inductors), as well as deposited and bonded interconnection wires. The connections to other parts of the system include electrical leads, heat removal paths, and mounting functions. At present, in order to meet the demands of VLSI, the emphasis is on packages with higher densities while maintaining performance, reliability, and low cost. This book is a comprehensive bibliography of over 3000 refer- ences of the world literature in microelectronic packaging. It is compiled to assist the workers in the field in comparing their work with that done by others. For easy access to the needed references, the book is divided into many sections and subsections (see Contents). A comprehensive subject index is also given to assure easy access to the needed data. The book cites a number of books and review articles for the beginner in the field who wishes to become familiar with the subject. Novel technologies, such as bubble domain and multilayer ceramic packaging are highlighted. The literature from January 1976 to December 1978 is covered.

Customers reviews

Frequently Asked Questions about the Book

All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews