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portada RF and Microwave Microelectronics Packaging II
Type
Physical Book
Publisher
Author
Language
English
Pages
172
Format
Paperback
Dimensions
23.4 x 15.6 x 1.0 cm
Weight
0.27 kg.
ISBN13
9783319847191
Categories

RF and Microwave Microelectronics Packaging II

Kuang, Ken ; Sturdivant, Rick (Author) · Springer · Paperback

RF and Microwave Microelectronics Packaging II - Kuang, Ken ; Sturdivant, Rick

New Book Imported to Netherlands
Delivery: 03 Jul - 07 Jul Shipping: 4 to 5 business days.
111,71 €
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111,71 €

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Synopsis "RF and Microwave Microelectronics Packaging II"

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

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