Hallo! Tracked shipping to Netherlands with Delivery Duty Paid for just €7 

Ship to
Netherlands
0

My Account

  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

menu

Select your country

Americas

Europe

Rest of the world

portada Solder Joint Reliability Assessment: Finite Element Simulation Methodology (Advanced Structured Materials)
Type
Physical Book
Publisher
Author
Year
2014
Language
English
Pages
174
Format
Hardcover
ISBN13
9783319000916
Edition No.
2014
Categories

Solder Joint Reliability Assessment: Finite Element Simulation Methodology (Advanced Structured Materials)

Mohd N. Tamin; Norhashimah M. Shaffiar (Author) · Springer · Hardcover

Solder Joint Reliability Assessment: Finite Element Simulation Methodology (Advanced Structured Materials) - Mohd N. Tamin; Norhashimah M. Shaffiar

Cheaper New Book Imported to Netherlands
Delivery: 16 Oct - 23 Oct Shipping: 15 to 19 business days.
€ 99,18
Faster New Book Imported to Netherlands
Delivery: 05 Oct - 07 Oct Shipping: 6 to 7 business days.
€ 134,63
Import costs and 9% BTW included in the price ✅
€ 99,18

Choose the list to add your product or create one New List

Go to My Wishlists
Calculate shipping cost

Synopsis "Solder Joint Reliability Assessment: Finite Element Simulation Methodology (Advanced Structured Materials) "

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Customers reviews

More customer reviews
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)

Frequently Asked Questions about the Book

Is the book original?

All books in our catalog are Original.

In what language is the book written?

The book is written in English.

What is the format of this book?

The binding of this edition is Hardcover.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews