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portada Testing of Interposer-Based 2.5d Integrated Circuits
Type
Physical Book
Author
Publisher
Language
English
Pages
182
Format
Paperback
Dimensions
23.4x15.6x1.1 cm
Weight
0.29 kg.
ISBN13
9783319854618
Edition No.
1
Categories

Testing of Interposer-Based 2.5d Integrated Circuits

Krishnendu Chakrabarty (Author) · Ran Wang (Author) · Springer · Paperback

Testing of Interposer-Based 2.5d Integrated Circuits - Wang, Ran ; Chakrabarty, Krishnendu

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Synopsis "Testing of Interposer-Based 2.5d Integrated Circuits"

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

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