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portada the simulation of thermomechanically induced stress in plastic encapsulated ic packages
Type
Physical Book
Publisher
Author
Year
1999
Language
English
Pages
160
ISBN
0792384857
ISBN13
9780792384854
Categories

the simulation of thermomechanically induced stress in plastic encapsulated ic packages

Kelly, Gerard (Author) · springer · Physical Book

the simulation of thermomechanically induced stress in plastic encapsulated ic packages - kelly, gerard

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