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Lau John Books

We found 30 Books for lau john

Basics Fashion Design 09: Designing Accessories: Exploring the Design and Construction of Bags, Shoes, Hats and Jewellery

Basics Fashion Design 09: Designing Accessories: Exploring the Design and Construction of Bags, Shoes, Hats and Jewellery

Lau, John
Bloomsbury Visual Arts, Paperback, New

€ 35,65
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

John Lau
Springer Nature Singapore, 2026, Paperback, New

€ 121,64
3d ic Integration and Packaging

3d ic Integration and Packaging

John Lau
Mcgraw Hill Book Co, 2015, 1 edition, Hardcover, New

€ 263,79
Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging

Lau, John
Springer, Paperback, New

€ 146,75
A Race Between Time and Money: Strategies for a Successful Retirement

A Race Between Time and Money: Strategies for a Successful Retirement

John Lau Cfp(R); Matthew Lau Cfp(R)
Lulu Publishing Services, Paperback, New

€ 20,48
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Lau, John H.
Springer, Hardcover, New

€ 169,66
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau, John H.
Springer, Paperback, New

€ 113,64
handbook of tape automated bonding

handbook of tape automated bonding

lau, john h.
springer, 1992, New

€ 193,89
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau, John H.
Springer, Hardcover, New

€ 169,66
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

John H. Lau
Springer Singapore, 2021, 1 edition, Hardcover, New

€ 153,65
Heterogeneous Integrations

Heterogeneous Integrations

Lau, John H.
Springer, Hardcover, New

€ 153,65
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

John H. Lau
Springer, 2018, 1 edition, Hardcover, New

€ 145,65
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau, John H.
Springer, Paperback, New

€ 121,64
Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration

Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration

Lau, John; Chiang, Kuo-Ning
Springer, 2026, Hardcover, New

€ 185,67
Reliability of Rohs-Compliant 2d and 3d ic Interconnects (Electronic Engineering)

Reliability of Rohs-Compliant 2d and 3d ic Interconnects (Electronic Engineering)

John Lau
Mcgraw-Hill Publ.Comp., 2010, 1 edition, Hardcover, New

€ 175,15
Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

John H. Lau; Ning-Cheng Lee
Springer, 2021, 1 edition, Paperback, New

€ 113,64
Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

John H. Lau; Ning-Cheng Lee
Springer, 2020, 1 edition, Hardcover, New

€ 153,65
the speculations on metaphysics, polity and morality of the old philosopher lau tsze

the speculations on metaphysics, polity and morality of the old philosopher lau tsze

Lau-Tsze ; Chalmers, John
Kessinger Publishing, 2004, Paperback, New

€ 25,60
the speculations on metaphysics, polity and morality of the old philosopher lau tsze

the speculations on metaphysics, polity and morality of the old philosopher lau tsze

Lau-Tsze ; Chalmers, John
Kessinger Publishing, 2010, Paperback, New

€ 31,96
The Speculations on Metaphysics, Polity and Morality of the Old Philosopher Lau Tsze

The Speculations on Metaphysics, Polity and Morality of the Old Philosopher Lau Tsze

Lau-Tsze ; Chalmers, John
Literary Licensing, LLC, Paperback, New

€ 34,09
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau, John H.
Springer, 1 edition, Paperback, New

€ 105,63
Diseño de Accesorios (in Spanish)

Diseño de Accesorios (in Spanish)

John Lau
Gustavo Gili, 2013, 1 edition, Paperback, New

€ 28,38
the speculations on metaphysics, polity and morality of the old philosopher lau tsze

the speculations on metaphysics, polity and morality of the old philosopher lau tsze

Lau-Tsze ; Chalmers, John
Kessinger Publishing, 2010, Hardcover, New

€ 47,96
Heterogeneous Integrations

Heterogeneous Integrations

John H. Lau
Springer, New

€ 59,42
Solder Joint Reliability: Theory and Applications

Solder Joint Reliability: Theory and Applications

John H. Lau
Springer, Paperback, New

€ 185,67
solder joint reliability,theory and applications

solder joint reliability,theory and applications

john h. (edt) lau
kluwer academic pub, New

€ 185,67
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

John Lau;Xuejun Fan
Springer Nature Switzerland AG, 2025, Hardcover, New

€ 169,66
Mindfulness for Child and Adolescent Well-Being. International Perspectives

Mindfulness for Child and Adolescent Well-Being. International Perspectives

Elsa Ngar Sze Lau;Kevin Ka Shing Chan;John Chi-Kin Lee
Routledge, 2025, Paperback, New

€ 53,62
Mindfulness for Child and Adolescent Well-Being: International Perspectives

Mindfulness for Child and Adolescent Well-Being: International Perspectives

Chan Kevin Ka Shing,Lau Elsa Ngar Sze,Lee John Chi-Kin
Routledge, Hardcover, New

€ 147,00
through-silicon vias (tsvs) for 3d integration

through-silicon vias (tsvs) for 3d integration

john h. lau
mc graw-hill, New

€ 224,50

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