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portada Introduction to Microelectronics Advanced Packaging Assurance
Type
Physical Book
Publisher
Language
English
Format
Hardcover
ISBN13
9783031861017

Introduction to Microelectronics Advanced Packaging Assurance

Asadizanjani Navid,Reddy Kottur Himanandhan,Dalir Hamed (Author) · Springer · Hardcover

Introduction to Microelectronics Advanced Packaging Assurance - Asadizanjani Navid,Reddy Kottur Himanandhan,Dalir Hamed

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Synopsis "Introduction to Microelectronics Advanced Packaging Assurance"

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.

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